Patent Assignment
Reel/Frame 055706/0772
Assignment of Assignor's Interest
Recorded: 2021-03-24
Pages: 3
Assignor
CHANG, KUEI-SUNG
Executed: 2021-03-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Package Structure Including a Base and a Lid Disposed Over the Base and Method of Forming the Package Structure