IP Library › Assignment 055864/0797
Patent Assignment
Reel/Frame 055864/0797

Assignment of Assignor's Interest

Recorded: 2021-04-08 Pages: 3
Assignors
CHEN, I-SHENG
Executed: 2021-03-04
LI, YI-JING
Executed: 2021-03-04
LI, CHEN-HENG
Executed: 2021-03-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Shallow Trench Isolation Structures Having Uniform Step Heights
Application: 17/225,249 →
Publication: US 2021/0375693
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 9, 2021
From: CHEN, I-SHENG; LI, YI-JING; LI, CHEN-HENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 055876/0298 →