Patent Assignment
Reel/Frame 055899/0129
Assignment of Assignor's Interest
Recorded: 2021-04-13
Pages: 4
Assignors
JIN, JISONG
Executed: 2021-03-31
KUCHANURI, SUBHASH
Executed: 2021-03-31
YOO, ABRAHAM
Executed: 2021-03-31
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
18 WENCHANG ROAD, BEIJING ECONOMIC- TECHNOLOGICAL DEVELOPMENT AREA, BEIJING, 100176, CHINA
Covered Property
(1)
Semiconductor Structure and Forming Method Thereof