Patent Assignment
Reel/Frame 055954/0462
Change of Name
Recorded: 2021-04-06
Pages: 32
Assignor
HITACHI CHEMICAL CO., LTD
Executed: 2020-10-15
Assignee
SHOWA DENKO MATERIALS CO., LTD.
1-9-2, MARUNOUCHI, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 2, 2019
From: HIGASHIUCHI, TOMOKO; MARUYAMA, NAOKI; YOSHIDA, YUKA; FUKUDA, KAZUMASA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 049061/0753 →
Change of Name
Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment.
Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →