Patent Assignment
Reel/Frame 056109/0375
Assignment of Assignor's Interest
Recorded: 2021-04-30
Pages: 3
Assignors
GOH, ENG HUAT
Executed: 2018-10-30
SIR, JIUN HANN
Executed: 2018-10-30
LIM, MIN SUET
Executed: 2018-10-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Systems, Methods, and Apparatuses for Implementing a Pad on Solder Mask (Posm) Semiconductor Substrate Package