Patent Assignment
Reel/Frame 056163/0881
Assignment of Assignor's Interest
Recorded: 2021-05-06
Pages: 5
Assignors
PENG, ZHEN
Executed: 2018-12-17
VO, SONNY
Executed: 2018-12-16
SOICHI, EMELINE
Executed: 2018-12-17
Assignee
LEIA INC.
2440 SAND HILL ROAD, SUITE 100, MENLO PARK, CALIFORNIA, 94025
Covered Properties
(2)
Wafer Tiling Method to Form Large-Area Mold Master Having Sub-Micrometer Features
Large Area Nanoimprint Lithography Using Wafer Tiling
Application:
62/681,662 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 22, 2022
From: LEIA INC.
To: LEIA SPV LLC
Reel/Frame 061509/0435 →
Security Interest
Sep 22, 2022
From: LEIA SPV LLC
To: AON IP ADVANTAGE FUND LP, AS AGENT
Reel/Frame 061509/0456 →
Assignment of Assignor's Interest
Aug 12, 2024
From: AON IP ADVANTAGE FUND LP, AS AGENT
To: LELIS, INC., AS AGENT
Reel/Frame 068548/0763 →