Patent Assignment
Reel/Frame 056234/0551
Assignment of Assignor's Interest
Recorded: 2021-05-13
Pages: 6
Assignors
RUBIN, JOSHUA M.
Executed: 2019-10-29
WRIGHT, STEVEN LORENZ
Executed: 2019-10-29
CLEVENGER, LAWRENCE A.
Executed: 2019-11-07
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Multi-Chip Package Structures Having Embedded Chip Interconnect Bridges and Fan-Out Redistribution Layers