Patent Assignment
Reel/Frame 056257/0297
Assignment of Assignor's Interest
Recorded: 2021-05-17
Pages: 7
Assignors
KARDA, KAMAL M.
Executed: 2021-05-03
PANDEY, DEEPAK CHANDRA
Executed: 2020-10-13
YANG, LITAO
Executed: 2020-10-12
GAO, YUNFEI
Executed: 2020-10-12
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Metal Insulator Semiconductor (Mis) Contact in Three Dimensional (3D) Vertical Memory
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 31, 2020
From: KARDA, KAMAL M.; PANDEY, DEEPAK CHANDRA; YANG, LITAO; PULUGURTHA, SRINIVAS
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053642/0913 →
Corrective Assignment to Correct the List of Recorded Inventors, to Include the Name of an Inventor That Was Left Off the Originally Recorded Assignment (Yunfei Gao) Previously Recorded on Reel 053642 Frame 0913. Assignor(S) Hereby Confirms the Assignment.
Sep 1, 2020
From: KARDA, KAMAL M.; PANDEY, DEEPAK CHANDRA; YANG, LITAO; PULUGURTHA, SRINIVAS
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053663/0226 →