Assignment of Assignor's Interest

Recorded: 2021-05-19 Pages: 5

Assignors

BERGMANN, MICHAEL JOHN

Executed: 2013-04-20

HABERERN, KEVIN

Executed: 2013-04-12

DILLON, ALAN WELLFORD

Executed: 2013-04-22

Assignee

CREE, INC.

4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703

Covered Property (1)

Wafer Level Packaging of Multiple Light Emitting Diodes (Leds) on a Single Carrier Die

Application: 15/493,735 →

Publication: US 2017/0271561

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.