Patent Assignment
Reel/Frame 056310/0653
Assignment of Assignor's Interest
Recorded: 2021-05-21
Pages: 8
Assignors
KOVITSOPHON, WICHAI
Executed: 2021-05-20
KITNARONG, RANGSUN
Executed: 2021-05-20
KENGANANTANON, EKGACHAI
Executed: 2021-05-20
POOLSUP, PATTARAPON
Executed: 2021-05-20
NOKDE, WATCHARAPONG
Executed: 2021-05-20
JUNJUEWONG, CHANYUTH
Executed: 2021-05-20
Assignee
MICROCHIP TECHNOLOGY INCORPORATED
2355 WEST CHANDLER BLVD., CHANDLER, ARIZONA, 85224-6199
Covered Property
(1)
Method of Forming a Surface-Mount Integrated Circuit Package with Solder Enhanced Leadframe Terminals