Patent Assignment
Reel/Frame 056327/0878
Assignment of Assignor's Interest
Recorded: 2021-05-24
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2021-05-06
CHEN, MING-FA
Executed: 2021-05-06
CHEN, YING-JU
Executed: 2021-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method of Forming Thereof