Patent Assignment
Reel/Frame 056346/0687
Assignment of Assignor's Interest
Recorded: 2021-05-25
Pages: 6
Assignors
SEOK, SEYEONG
Executed: 2021-04-29
KANG, UN-BYOUNG
Executed: 2021-04-29
LEE, CHUNGSUN
Executed: 2021-04-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same