IP Library Assignment 056404/0332
Patent Assignment
Reel/Frame 056404/0332

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2021-06-01 Received: 2021-06-01 Pages: 9
Assignors
CHAI, SEUNGYONG
Executed: 2016-03-31
CHO, SUNGWON
Executed: 2016-03-31
HAN, BYUNG JOON
Executed: 2016-03-31
KIM, SUNGSOO
Executed: 2016-03-31
KOO, KYOWANG
Executed: 2016-03-31
LEE, HUN TEAK
Executed: 2016-03-31
LIN, YAOJIAN
Executed: 2016-03-31
PARK, KYOUNGHEE
Executed: 2016-03-31
SHIM, IL KWON
Executed: 2016-03-31
YANG, DEOKKYUNG
Executed: 2016-03-31
YOON, IN SANG
Executed: 2016-03-31
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications (2)
PROCESSES FOR SEPARATING WHOLE STILLAGE TO PRODUCE A FIBER RICH PRODUCT THAT INCLUDES C5 AND C6 POLYSACCHARIDES
App. No. 16/102,835
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
App. No. 16/005,387