Patent Assignment
Reel/Frame 056431/0460
Assignment of Assignor's Interest
Recorded: 2021-06-03
Pages: 5
Assignee
CHUGAI SEIYAKU KABUSHIKI KAISHA
5-1, UKIMA 5-CHOME, KITA-KU, TOKYO, 1158543, JAPAN
Covered Property
(1)
Deprotection Method and Resin Removal Method in Solid-Phase Reaction for Peptide Compound or Amide Compound, and Method for Producing Peptide Compound