Patent Assignment
Reel/Frame 056497/0952
Assignment of Assignor's Interest
Recorded: 2021-06-10
Pages: 6
Assignors
LEE, JAEEAN
Executed: 2021-06-04
JOO, CHANGEUN
Executed: 2021-06-04
CHOI, GYUJIN
Executed: 2021-06-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Under Bump Metallization Pad