IP Library Assignment 056530/0222
Patent Assignment
Reel/Frame 056530/0222

Assignment of Assignor's Interest

Recorded: 2021-06-14 Pages: 4
Assignor
HENKEL AG & CO. KGAA
Executed: 2021-06-14
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property (1)
Solder Paste Composition, a Solder Paste and a Soldering Flux
Patent: 9,511,453 →
Application: 13/530,751 →
Publication: US 2013/0042946
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 4, 2016
From: YANG, HUIYING; LU, DAOQIANG
To: HENKEL AG & CO. KGAA
Reel/Frame 037890/0808 →
Assignment of Assignor's Interest Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
Assignment of Assignor's Interest Jan 24, 2023
From: HENKEL AG & CO. KGAA
To: HARIMA CHEMICALS GROUP, INC.
Reel/Frame 062467/0399 →