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Patent Assignment

Reel/Frame 056530/0398

CHANGE OF NAME

Recorded: 2021-06-02 Received: 2021-06-02 Pages: 8

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Assignor

STATS CHIPPAC LTD.

Executed: 2016-03-29

Assignee

STATS CHIPPAC PTE. LTD.

10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE

Covered Application (1)

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF

App. No. 16/005,387