Patent Assignment
Reel/Frame 056691/0799
Assignment of Assignor's Interest
Recorded: 2021-06-28
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and a Package-on-Package Including the Same