Patent Assignment
Reel/Frame 056777/0669
Assignment of Assignor's Interest
Recorded: 2021-07-07
Pages: 3
Assignor
CLAVETTE, DANNY
Executed: 2019-03-08
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property
(1)
Semiconductor Package and Methods of Manufacturing a Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 7, 2021
From: FEIL, THOMAS; GANITZER, PAUL; POELZL, MARTIN; VON KOBLINSKI, CARSTEN
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 056777/0942 →
Assignment of Assignor's Interest
Jul 26, 2022
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 060618/0220 →