Patent Assignment
Reel/Frame 056881/0214
Assignment of Assignor's Interest
Recorded: 2021-07-16
Pages: 4
Assignors
WANG, CHIH-CHING
Executed: 2020-12-07
CHEN, WEN-YUAN
Executed: 2021-01-11
SU, CHUN-CHUNG
Executed: 2020-12-14
HO, JON-HSU
Executed: 2020-12-14
HSIEH, WEN-HSING
Executed: 2021-01-13
CHENG, KUAN-LUN
Executed: 2020-12-07
WU, CHUNG-WEI
Executed: 2021-03-31
WU, ZHI-QIANG
Executed: 2020-12-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure Incorporating Air Gap