Patent Assignment
Reel/Frame 056887/0390
Assignment of Assignor's Interest
Recorded: 2021-07-16
Pages: 3
Assignors
LAI, CHI-HUI
Executed: 2021-07-12
CHEN, YANG-CHE
Executed: 2021-07-12
LIN, CHEN-HUA
Executed: 2021-07-12
LIANG, VICTOR CHIANG
Executed: 2021-07-12
LIU, CHWEN-MING
Executed: 2021-07-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method of Testing Semiconductor Package