Patent Assignment
Reel/Frame 057037/0369
Assignment of Assignor's Interest
Recorded: 2021-07-30
Pages: 5
Assignors
NAKAGAWA, HIDEO
Executed: 2021-06-24
OGAWA, YOSHINORI
Executed: 2021-06-24
MATSUMOTO, NOBUAKI
Executed: 2021-07-07
UEDA, SHUHEI
Executed: 2021-06-28
OHORI, KEIJI
Executed: 2021-06-24
OTAKE, KOHEI
Executed: 2021-07-07
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Microstructure-Transfer Apparatus, Stamp Head Unit, Stamp Component for Transferring Microstructure, and Method for Transferring Microstructure-Integrated Component