IP Library › Assignment 057103/0294
Patent Assignment
Reel/Frame 057103/0294

Assignment of Assignor's Interest

Recorded: 2021-08-06 Pages: 4
Assignors
BYWALEZ, ROBERT FELIX
Executed: 2021-05-14
STEINHAEUSSER, UTE
Executed: 2021-05-14
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Corrosion Resistant Pad for Enhanced Thin Film Acoustic Packaging (Tfap)
Application: 17/223,923 →
Publication: US 2022/0321077
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's Name and Address Previously Recorded at Reel: 057103 Frame: 0294. Assignor(S) Hereby Confirms the Assignment. Oct 8, 2021
From: BYWALEZ, ROBERT FELIX; STEINHAEUSSER, UTE
To: RF360 EUROPE GMBH
Reel/Frame 058051/0243 →
Assignment of Assignor's Interest Mar 16, 2023
From: RF360 EUROPE GMBH
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 063272/0475 →
Change of Owner's Address Aug 27, 2024
From: RF360 SINGAPORE PTE. LTD.
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 068788/0486 →