Patent Assignment
Reel/Frame 057130/0151
Assignment of Assignor's Interest
Recorded: 2021-08-10
Pages: 3
Assignor
SAITO, YOSHINOBU
Executed: 2021-07-26
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Grinding Wheel and Wafer Grinding Method