Patent Assignment
Reel/Frame 057157/0368
Assignment of Assignor's Interest
Recorded: 2021-08-12
Pages: 5
Assignors
PARK, INWON
Executed: 2021-07-12
KIM, BOSOON
Executed: 2021-07-12
PARK, JONGSOON
Executed: 2021-07-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including an Isolation Insulating Pattern with a First Bottom Surface, a Second Bottom Surface, and a Third Bottom Surface Therebetween, Where the Third Bottom Surface Has a Different Height Than the First and Second Bottom Surfaces