Patent Assignment
Reel/Frame 057164/0468
Assignment of Assignor's Interest
Recorded: 2021-08-12
Pages: 6
Assignors
RICHARDSON, THOMAS
Executed: 2017-09-19
WHITTEN, KYLE
Executed: 2017-09-19
PANECCASIO, VINCENT, JR.
Executed: 2017-09-19
COMMANDER, JOHN
Executed: 2017-09-19
HURTUBISE, RICHARD
Executed: 2017-09-19
Assignee
MACDERMID ENTHONE INC.
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Properties
(2)
Copper Deposition in Wafer Level Packaging of Integrated Circuits
Copper Deposition in Wafer Level Packaging of Integrated Circuits