IP Library Assignment 057237/0339
Patent Assignment
Reel/Frame 057237/0339

Assignment of Assignor's Interest

Recorded: 2021-08-20 Pages: 18
Assignors
MEYER, JERRY R.
Executed: 2019-07-12
VURGAFTMAN, IGOR
Executed: 2019-07-12
CANEDY, CHAWICK LAWRENCE
Executed: 2019-07-12
BEWLEY, WILLIAM W.
Executed: 2019-07-12
KIM, CHUL SOO
Executed: 2019-07-12
MERRITT, CHARLES D.
Executed: 2019-07-12
KIM, MIJIN
Executed: 2019-07-13
WARREN, MICHAEL V.
Executed: 2019-07-11
WEIBLEN, R. JOSEPH
Executed: 2019-07-12
Assignee
THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY
875 NORTH RANDOLPH STREET, SUITE 1425, ARLINGTON, VIRGINIA, 22203
Covered Properties (9)
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,212 →
Publication: US 2021/0389241
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,216 →
Publication: US 2021/0396664
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,223 →
Publication: US 2021/0396665
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,230 →
Publication: US 2021/0396666
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,239 →
Publication: US 2021/0396667
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,246 →
Publication: US 2021/0396668
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,257 →
Publication: US 2021/0396669
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,261 →
Publication: US 2021/0404957
Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits
Application: 17/407,263 →
Publication: US 2021/0389242