Patent Assignment
Reel/Frame 057294/0225
Assignment of Assignor's Interest
Recorded: 2021-08-26
Pages: 5
Assignors
HUANG, HSIN-YEN
Executed: 2020-12-14
LO, TING-YA
Executed: 2020-12-15
LEE, SHAO-KUAN
Executed: 2020-12-14
TENG, CHI-LIN
Executed: 2020-12-14
LEE, CHENG-CHIN
Executed: 2020-12-14
SHUE, SHAU-LIN
Executed: 2021-01-11
CHANG, HSIAO-KANG
Executed: 2020-12-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Barrier & Air-Gap Scheme for High Performance Interconnects