Patent Assignment
Reel/Frame 057307/0866
Assignment of Assignor's Interest
Recorded: 2021-08-27
Pages: 5
Assignors
LO, TING-YA
Executed: 2021-02-21
LEE, CHENG-CHIN
Executed: 2021-02-21
LEE, SHAO-KUAN
Executed: 2021-02-18
TENG, CHI-LIN
Executed: 2021-02-18
HUANG, HSIN-YEN
Executed: 2021-02-18
CHANG, HSIAOKANG
Executed: 2021-02-18
SHUE, SHAU-LIN
Executed: 2021-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure Having Air Gap and Methods of Forming the Same