Patent Assignment
Reel/Frame 057328/0083
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 4
Assignors
HUANG, HUI-MIN
Executed: 2021-01-08
CHENG, MING-DA
Executed: 2021-01-13
LIN, WEI-HUNG
Executed: 2020-12-29
HSUEH, CHANG-JUNG
Executed: 2020-12-30
ZHAN, KAI-JUN
Executed: 2021-01-08
LIN, YUNG-SHENG
Executed: 2021-01-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Structure and Method for Forming the Same