Patent Assignment
Reel/Frame 057328/0316
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 5
Assignors
HUANG, SHAN-YU
Executed: 2020-12-29
CHENG, MING-DA
Executed: 2021-01-13
CHUNG, HSIAO-WEN
Executed: 2021-01-05
HSIAO, CHING-WEN
Executed: 2020-12-29
HUNG, LI-CHUN
Executed: 2020-12-29
CHANG, YUAN-YAO
Executed: 2021-01-08
HSIEH, MENG-HSIU
Executed: 2020-12-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Structure and Method for Forming the Same