Patent Assignment
Reel/Frame 057328/0996
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method for Wafer Backside Polishing