Patent Assignment
Reel/Frame 057354/0393
Assignment of Assignor's Interest
Recorded: 2021-09-01
Pages: 4
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Separation Method of Wafer