IP Library Assignment 057468/0500
Patent Assignment
Reel/Frame 057468/0500

Assignment of Assignor's Interest

Recorded: 2021-09-10 Pages: 3
Assignors
JEONG, DO YOUNG
Executed: 2021-03-30
AHN, JIN MO
Executed: 2021-03-30
JEONG, EUN HEE
Executed: 2021-03-30
AN, GA YOUNG
Executed: 2021-03-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component
Application: 17/470,242 →
Publication: US 2022/0208467