Patent Assignment
Reel/Frame 057590/0628
Assignment of Assignor's Interest
Recorded: 2021-09-24
Pages: 5
Assignors
ZHANG, KUN
Executed: 2021-09-01
ZHOU, WENXI
Executed: 2021-09-01
LIU, WEI
Executed: 2021-09-02
XIA, ZHILIANG
Executed: 2021-09-01
CHEN, LIANG
Executed: 2021-09-06
WANG, YANHONG
Executed: 2021-09-02
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Three-Dimensional Memory Devices Having Semiconductor Assemblies Bonded by Bonding Layer and Methods for Forming the Same