Patent Assignment
Reel/Frame 057669/0496
Assignment of Assignor's Interest
Recorded: 2021-10-01
Pages: 6
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device