Patent Assignment
Reel/Frame 057705/0774
Assignment of Assignor's Interest
Recorded: 2021-10-05
Pages: 6
Assignors
SEDDON, MICHAEL J.
Executed: 2016-08-01
NOMA, TAKASHI
Executed: 2016-08-08
SAITO, KAZUHIRO
Executed: 2016-08-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 17, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059032/0300 →
Release of Security Interest in Patents Previously Recorded at Reel 059032, Frame 0300
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0502 →