Patent Assignment
Reel/Frame 057777/0820
Assignment of Assignor's Interest
Recorded: 2021-10-13
Pages: 5
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2021-10-07
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
39, CHEMIN DU CHAMP DES FILLES, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Property
(1)
Flip-Chip Fan-Out Wafer Level Package for Package-on-Package Applications, and Method of Manufacture
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.