Patent Assignment
Reel/Frame 057781/0681
Assignment of Assignor's Interest
Recorded: 2021-10-13
Pages: 3
Assignee
NXP USA, INC. LAW DEPARTMENT
6501 WILLIAM CANNON DRIVE WEST TX30/0E62, AUSTIN, TEXAS, 78735
Covered Property
(1)
Die-Substrate Assemblies Having Sinter-Bonded Backside via Structures and Associated Fabrication Methods