Patent Assignment
Reel/Frame 057971/0559
Corrective Assignment to Correct the Serial Number 17466765 Previously Recorded at Reel: 057621 Frame: 0790. Assignor(S) Hereby Confirms the Assignment .
Recorded: 2021-10-29
Pages: 8
Assignors
YONETSU, MAKI
Executed: 2021-09-02
SUENAGA, SEIICHI
Executed: 2021-09-03
FUJISAWA, SACHIKO
Executed: 2021-09-03
NABA, TAKAYUKI
Executed: 2021-09-02
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
TOSHIBA MATERIALS CO., LTD.
8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Bonded Body, Circuit Board, and Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 28, 2021
From: YONETSU, MAKI; SUENAGA, SEIICHI; FUJISAWA, SACHIKO; NABA, TAKAYUKI
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA MATERIALS CO., LTD.
Reel/Frame 057621/0790 →
Nunc Pro Tunc Assignment
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO. LTD.
Reel/Frame 074940/0511 →
Change of Name
Feb 19, 2026
From: TOSHIBA MATERIALS CO. LTD.
To: NITERRA MATERIALS CO., LTD.
Reel/Frame 074941/0803 →
Change of Address
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 074941/0846 →