Patent Assignment
Reel/Frame 058101/0671
Assignment of Assignor's Interest
Recorded: 2021-11-12
Pages: 12
Assignors
ECTON, JEREMY D.
Executed: 2021-08-20
MARIN, BRANDON C.
Executed: 2021-08-16
PIETAMBARAM, SRINIVAS V.
Executed: 2021-08-16
NAD, SUDDHASATTWA
Executed: 2021-08-19
ARANA, LEONEL
Executed: 2021-08-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Fine Bump Pitch Die to Die Tiling Incorporating an Inverted Glass Interposer
Application:
17/473,099 →
Publication:
US 2023/0079607