Patent Assignment
Reel/Frame 058256/0356
Assignment of Assignor's Interest
Recorded: 2021-12-01
Pages: 8
Assignors
IM, SEUNGWON
Executed: 2017-08-30
JEON, OSEOB
Executed: 2017-08-30
LEE, BYOUNGOK
Executed: 2017-08-30
LEE, YOONSOO
Executed: 2017-08-30
SON, JOONSEO
Executed: 2017-09-24
LEE, DUKYONG
Executed: 2017-08-30
PARK, CHANGYOUNG
Executed: 2017-09-22
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Integrated Circuit Direct Cooling Systems having Substrates in Contact with a Cooling Medium
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 17, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059032/0300 →
Release of Security Interest in Patents Previously Recorded at Reel 059032, Frame 0300
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0502 →