Patent Assignment
Reel/Frame 058258/0648
Assignment of Assignor's Interest
Recorded: 2021-12-01
Pages: 9
Assignors
ST. GERMAIN, STEPHEN
Executed: 2019-08-15
YODER, JAY A.
Executed: 2019-08-27
CONNER, DENNIS LEE
Executed: 2019-08-27
CERVANTES, FRANK ROBERT
Executed: 2019-08-27
CELAYA, ANDREW
Executed: 2019-08-27
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Package Structures and Methods of Manufacture
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 17, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059032/0300 →
Release of Security Interest in Patents Previously Recorded at Reel 059032, Frame 0300
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0502 →