Patent Assignment
Reel/Frame 058286/0120
Assignment of Assignor's Interest
Recorded: 2021-12-03
Pages: 3
Assignor
KIM, RYOUNG-HAN
Executed: 2011-04-27
Assignee
GLOBALFOUNDRIES, INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Multilayer Interconnect Structure and Method for Integrated Circuits
Patent:
50,384 →
Application:
17/542,158 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 2021
From: GLOBALFOUNDRIES, INC.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 058286/0128 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Sep 23, 2024
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 069019/0067 →