Patent Assignment
Reel/Frame 058367/0423
Assignment of Assignor's Interest
Recorded: 2021-12-13
Pages: 5
Assignors
NOH, CHANGHO
Executed: 2021-09-06
LEE, INSU
Executed: 2021-09-06
HYUN, SONGWON
Executed: 2021-06-12
KO, YOONSEOK
Executed: 2021-09-06
KIM, MIJEONG
Executed: 2021-09-06
LEE, KEECHANG
Executed: 2021-09-06
JEE, SANGSOO
Executed: 2021-09-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Epoxy Compound, Composition Prepared Therefrom, Semiconductor Device Prepared Therefrom, Electronic Device Prepared Therefrom, Article Prepared Therefrom, and Method of Preparing Epoxy Compound