Patent Assignment
Reel/Frame 058452/0158
Assignment of Assignor's Interest
Recorded: 2021-12-21
Pages: 15
Assignors
ECTON, JEREMY
Executed: 2021-12-19
GAMBA, JASON M.
Executed: 2021-12-17
MARIN, BRANDON C.
Executed: 2021-12-17
PIETAMBARAM, SRINIVAS V.
Executed: 2021-12-16
SUN, XIAOXUAN
Executed: 2021-12-16
KARHADE, OMKAR G.
Executed: 2021-12-16
BRUN, XAVIER FRANCOIS
Executed: 2021-12-21
LI, YONGGANG
Executed: 2021-12-16
NAD, SUDDHASATTWA
Executed: 2021-12-20
SHAN, BOHAN
Executed: 2021-12-16
CHEN, HAOBO
Executed: 2021-12-15
DUAN, GANG
Executed: 2021-12-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Assemblies Including Interconnects with Different Solder Materials