Patent Assignment
Reel/Frame 058502/0623
Assignment of Assignor's Interest
Recorded: 2021-12-29
Pages: 3
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Packaged Microelectronic Devices Having Stacked Interconnect Elements and Methods for Manufacturing the Same
Application:
17/565,027 →
Publication:
US 2022/0122938