Patent Assignment
Reel/Frame 058539/0355
Assignment of Assignor's Interest
Recorded: 2022-01-04
Pages: 3
Assignor
HE, DUANWEI
Executed: 2021-11-10
Assignee
CHENGDU DONGWEI TECHNOLOGY CO., LTD
2039 SOUTH SECTION OF TIANFU AVENUE, TIANFU NEW DISTRICT, CHENGDU, SICHUAN PROVINCE, 61021, CHINA
Covered Property
(1)
Producing Polycrystalline Diamond Compact (Pdc) Drill Bits with Catalyst-Free and Substrate-Free Pdc Cutters
Application:
17/567,531 →
Publication:
US 2023/0211414
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.