Patent Assignment
Reel/Frame 058753/0781
Assignment of Assignor's Interest
Recorded: 2022-01-25
Pages: 3
Assignor
AKASAKA, TATSUO
Executed: 2021-11-11
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Three-Dimensional Shaping Device And Method For Manufacturing Three-Dimensional Shaped Object