Patent Assignment
Reel/Frame 058849/0699
Assignment of Assignor's Interest
Recorded: 2022-02-01
Pages: 4
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Inspection Device, Inspection Method of Semiconductor Substrate, Manufacturing Method of Semiconductor Substrate, and Manufacturing Method of Semiconductor Device
Application:
17/590,435 →
Publication:
US 2022/0336293